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d a t a sh eet product speci?cation supersedes data of 1998 nov 17 file under integrated circuits, ic02 2000 feb 21 integrated circuits TDA8044 satellite demodulator and decoder
2000 feb 21 2 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 features general features: C one-chip digital video broadcasting (dvb) compliant quadrature phase shift keying (qpsk) and binary phase shift keying (bpsk) demodulator and concatenated viterbi/reed-solomon decoder with de-interleaver and de-randomizer (ets 300 421) C 3.3 v supply voltage (input pads are 5 v tolerant) C standby mode for low power dissipation C internal clock pll to allow low frequency crystal application and selectable clock frequencies C power-on reset module C package: qfp100 C boundary scan test. qpsk/bpsk demodulator: C interpolator and anti-alias filter to handle a large range of symbol rates without additional external filtering C on-chip agc of the analog input i and q baseband signals or tuner agc control C two on-chip matched analog-to-digital converters (adcs; 7 bits) C half nyquist (square root raised-cosine) filter with selectable roll-off factor C large range of symbol frequencies: 0.5 to 45 msymbols/s for TDA8044 and 0.5 to 30 msymbols/s for TDA8044a, including single carrier per channel (scpc) function C can be used at low channel signal-to-noise ratio (s/n) C internal carrier recovery, clock recovery and agc loops with programmable loop filters C two loop carrier recovery enabling phase tracking of the incoming symbols C software carrier sweep for low symbol rate applications C signal-to-noise ratio estimation C external indication of demodulator lock. viterbi decoder: C rate 1 2 convolutional code based C constraint length k = 7 with g 1 = 171 oct and g 2 = 133 oct ; supported puncturing code rates: 1 2 , 2 3 , 3 4 , 4 5 , 5 6 , 6 7 , 7 8 and 8 9 C 4 bits input for soft decision for both i and q C truncation length: 144 C automatic synchronization C channel bit error rate (ber) estimation C external indication of viterbi sync lock C differential decoding optional. reed-solomon (rs) decoder: C (204, 188, t = 8) reed-solomon code C automatic (i 2 c-bus configurable) synchronization of bytes, transport packets and frames C internal convolutional de-interleaving (i = 12; using internal memory) C de-randomizer based on pseudo random bit sequence (prbs) C external indication of register select (rs) decoder sync lock C external indication of uncorrectable error (transport error indicator is set) C external indication of corrected byte C indication of the number of lost blocks C indication of the number of corrected blocks. interface: Ci 2 c-bus interface to initialize and monitor the demodulator and forward error correction (fec) decoder; when no i 2 c-bus usage, default mode is defined C programmable interrupt facility C 6 bits i/o expander for flexible access to and from the i 2 c-bus C switchable i 2 c-bus loop-through to suppress i 2 c-bus crosstalk in the tuner C diseqc level 1.x support for dish control applications C 3-state mode for transport stream outputs. applications digital satellite tv: demodulation and forward error correction (fec).
2000 feb 21 3 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 general description this document gives preliminary information about the TDA8044 and TDA8044a, which are the successors of the tda8043. the TDA8044a is only specified where the product deviates from the TDA8044, all other references are the same. the TDA8044 is backwards compatible with the tda8043, with respect to pinning and the i 2 c-bus software. the TDA8044 is a dvb compliant demodulator and error correction decoder ic for reception of qpsk and bpsk modulated signals for satellite applications. it can handle variable symbol rates in the range of 0.5 to 45 msymbols/s (0.5 to 30 msymbols/s for TDA8044a) with a minimum number of low cost and non-critical external components. typical applications for this device are multi channel per carrier (mcpc), single channel per carrier (scpc) and simulcast. in these applications one satellite transponder contains respectively one broad qpsk carrier, several small qpsk carriers and one small qpsk carrier together with one or two fm carriers. the TDA8044 has minimum interface with the tuner, it only requires the demodulated analog i and q baseband input signals. analog-to-digital conversion is performed internally by two matched 7-bit adcs. since all the loops (agc, clock and carrier recovery) are internal, no feedback to the tuner is needed. however, for maximum tuner flexibility, there is the possibility to close the agc and carrier recovery loop externally via the tuner. the number of external components required for operation of the TDA8044 is very low. moreover the external components are low cost and non-critical. this gives an easy and low cost application. the TDA8044 operates on a low frequency crystal which is upconverted to a clock frequency by means of an internal pll. different clock frequencies can be selected with the pll without changing the crystal. this allows for maximum flexibility concerning symbol rate range combined with minimum power consumption. the TDA8044 also has internal anti-alias filters, which can cover a large range of symbol frequencies (approximately one decade) without the need to switch external (saw) filters. to cover the whole range of 0.5 to 45 msymbols/s switching of clock frequency (internally) and filtering (externally) is necessary. the TDA8044 has a double carrier loop configuration which has excellent capabilities of tracking phase noise. synchronization of the fec unit is done completely internally, thereby minimizing i 2 c-bus communication. the output of the TDA8044 is highly flexible, allowing different output modes to interface to a demultiplexer/descrambler/mpeg-2 decoder including a 3-state mode. for evaluation of the TDA8044, demodulator and viterbi outputs can be made available externally. interfacing to the TDA8044 has been extended compared to the tda8043. separate resets are available for logic only, logic plus i 2 c-bus and carrier loops. a power-on reset module has been implemented which gives a reset signal at power-up. this signal can be used to reset the TDA8044 in order to guarantee correct starting of the ic. two extra general purpose i/o pins (i/o expanders) have been added. a switchable i 2 c-bus loop-through to the tuner is implemented to switch-off the i 2 c-bus connection to the tuner. this reduces phase noise in the tuner in the event of i 2 c-bus crosstalk. the transport stream outputs can be put in 3-state mode. diseqc level 1.x support is integrated for dish control applications. the power consumption in standby mode has been decreased considerably.
2000 feb 21 4 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 quick reference data notes 1. programmable internal frequencies possible: a) values 10.7, 16, 32 or 64 mhz for cfs = 0. b) values 16, 24, 48 or 96 mhz for cfs = 1. 2. cfs is set to logic 0. 3. without switching internal clock frequencies, a range of 1 decade can be covered. to cover the full range of symbol frequencies, internal clock frequencies and external (saw) filters must be switched. details can be found in the application note. 4. maximum value is specified for a symbol rate of 45 msymbols/s, a puncturing rate of 7 8 , a clock frequency of 96 mhz and a 3.55 v power supply. the typical value is specified for a symbol rate of 27.5 msymbols/s, a puncture rate of 3 4 and a clock frequency of 64 mhz. 5. implementation loss at the demodulator output and minimum s/n to lock the TDA8044 are measured including tuner in a laboratory environment at a symbol rate of 27.5 msymbols/s and a clock frequency of 64 mhz. ordering information symbol parameter conditions min. typ. max. unit v dda analog supply voltage 3.05 3.3 3.55 v v ddd digital supply voltage 3.05 3.3 3.55 v i dd(tot) total supply current v ddd = 3.3 v TDA8044 note 1 - 320 480 ma TDA8044a notes 1 and 2 -- 350 ma f clk internal clock frequency cfs = 0 or cfs = 1; f xtal = 4 mhz TDA8044 note 1 10.7 - 96 mhz TDA8044a notes 1 and 2 10.7 - 64 mhz r s symbol rate note 3 TDA8044 0.5 - 45 msymbols/s TDA8044a 0.5 - 30 msymbols/s p tot total power dissipation t amb =70 c; note 4 TDA8044 - 1150 1700 mw TDA8044a -- 1250 mw il implementation loss note 5 - 0.3 - db s/n signal-to-noise ratio for locking the TDA8044 note 5 2 -- db type number package name description version TDA8044h qfp100 plastic quad ?at package; 100 leads (lead length 1.95 mm); body 14 20 2.8 mm sot317-2 TDA8044ah
2000 feb 21 5 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 pinning symbol pin i/o description i2 1 i digital i-input bit 2 (adc bypass) i3 2 i digital i-input bit 3 (adc bypass) v ssd1 3 - digital ground 1 cfs 4 i clock frequency selection (remains at logic 0 for TDA8044a) v ssd2 5 - digital ground 2 i4 6 i digital i-input bit 4 (adc bypass) i5 7 i digital i-input bit 5 (adc bypass) i6 8 i digital i-input bit 6 (adc bypass: msb) q0 9 i digital q-input bit 0 (adc bypass: lsb) v ddd1 10 - digital supply voltage 1 q1 11 i digital q-input bit 1 (adc bypass) q2 12 i digital q-input bit 2 (adc bypass) q3 13 i digital q-input bit 3 (adc bypass) q4 14 i digital q-input bit 4 (adc bypass) v ssd3 15 - digital ground 3 q5 16 i digital q-input bit 5 (adc bypass) q6 17 i digital q-input bit 6 (adc bypass: msb) v ssd4 18 - digital ground 4 v ddd2 19 - digital supply voltage 2 preset 20 i set device into default mode p3 21 i/o quasi-bidirectional i/o port (bit 3) p2 22 i/o quasi-bidirectional i/o port (bit 2) p1 23 i/o quasi-bidirectional i/o port (bit 1) p0 24 i/o quasi-bidirectional i/o port (bit 0) v ddd3 25 - digital supply voltage 3 p5 26 i/o quasi-bidirectional i/o port (bit 5) p4 27 i/o quasi-bidirectional i/o port (bit 4) pdoclk 28 o output clock for transport stream bytes pdo0 29 o parallel data output (bit 0) pdo1 30 o parallel data output (bit 1) pdo2 31 o parallel data output (bit 2) v ssd5 32 - digital ground 5 pdo3 33 o parallel data output (bit 3) pdo4 34 o parallel data output (bit 4) pdo5 35 o parallel data output (bit 5) v ssd6 36 - digital ground 6 v ssd7 37 - digital ground 7 pdo6 38 o parallel data output (bit 6) por 39 i power-on reset [can be connected to preset (pin 20)] v ddd4 40 - digital supply voltage 4
2000 feb 21 6 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 v ddd5 41 - digital supply voltage 5 v ssd8 42 - digital ground 8 v ddd6 43 - digital supply voltage 6 v ddd7 44 - digital supply voltage 7 pdo7 45 o parallel data output (bit 7) n.c. 46 - not connected v ssd9 47 - digital ground 9 pdoerr 48 0 transport error indicator pdoval 49 o data valid indicator pdosync 50 0 transport packet synchronization signal v ssd10 51 - digital ground 10 scl 52 i serial clock input of i 2 c-bus sda 53 i/o serial data of i 2 c-bus int 54 o interrupt output (active low) a0 55 i i 2 c-bus hardware address rslock 56 o reed-solomon lock indicator vlock 57 o viterbi lock indicator dlock 58 o demodulator lock indicator v ddd8 59 - digital supply voltage 8 v ddd9 60 - digital supply voltage 9 test 61 i test pin (normally connected to ground) trst 62 i bst optional asynchronous reset (normally connected to ground) tck 63 i bst dedicated test clock (normally connected to ground) sclt 64 i serial clock of i 2 c-bus loop-through sdat 65 i/o serial data of i 2 c-bus loop-through v ddd10 66 - digital supply voltage 10 v ssd11 67 - digital ground 11 v ssd12 68 - digital ground 12 tms 69 i bst input control signal (normally connected to ground) tdo 70 o bst serial test data output tdi 71 i bst serial test data in (normally connected to ground) v ddd11 72 - digital supply voltage 11 v ssd13 73 - digital ground 13 v ssd(ad) 74 - digital ground adc v ddd(ad) 75 - digital supply adc v ref(b) 76 o bottom reference voltage for adc v ssa1 77 - analog ground 1 qa 78 - analog input q v ref(q) 79 o agc decoupling - q path ia 80 i analog input i v ssa2 81 - analog ground 2 symbol pin i/o description
2000 feb 21 7 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 v ref(i) 82 o agc decoupling - i path v dda 83 - analog supply voltage v ddxtal 84 - supply voltage for crystal oscillator xtali 85 i crystal oscillator input xtalo 86 o crystal oscillator output v ssxtal 87 - ground for crystal oscillator v ddd12 88 - digital supply voltage 12 v ddd13 89 - digital supply voltage 13 v ssd14 90 - digital ground 14 d22 91 o 22 khz output for dish control applications v ssd15 92 - digital ground 15 v ssd16 93 - digital ground 16 v agc 94 o agc output voltage v ssd(test) 95 - test pin, normally connected to ground v ddd14 96 - digital supply voltage 14 v ddd15 97 - digital supply voltage 15 oustd 98 o general purpose sigma-delta output i0 99 i digital i-input bit 0 (adc bypass: lsb) i1 100 i digital i-input bit 1 (adc bypass) symbol pin i/o description
2000 feb 21 8 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 fig.1 pin configuration. handbook, full pagewidth 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 ia v ref(q) qa v ssa1 v ref(b) v ddd(ad) v ssd(ad) v ssd13 v ddd11 tdi tdo tms v ssd12 v ssd11 v ddd10 sdat sclt tck trst test v ddd9 v ddd8 dlock vlock rslock a0 int sda scl v ssd10 i2 i3 v ssd1 cfs v ssd2 i4 i5 i6 q0 v ddd1 q1 q2 q3 q4 v ssd3 q5 q6 v ssd4 v ddd2 preset p3 p2 p1 p0 v ddd3 p5 p4 pdoclk pdo0 pdo1 pdo2 v ssd5 pdo3 pdo4 pdo5 v ssd6 v ssd7 pdo6 por v ddd4 v ddd5 v ssd8 v ddd6 v ddd7 pdo7 n.c. v ssd9 pdoerr pdoval pdosync i1 i0 oustd v ddd15 v ddd14 v ssd(test) v ssd16 v ssd15 v agc d22 v ssd14 v ddd13 v ddd12 v ssxtal xtalo xtali v ddxtal v dda v ref(i) v ssa2 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 mgm606 TDA8044 TDA8044a for compatibility in respect to the tda8043 see section pin compatibility.
2000 feb 21 9 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 pin compatibility the TDA8044 is backwards pin compatible with the tda8043, this means that the functional pins of the tda8043 have been left unchanged on the TDA8044. however due to extra functionality of the TDA8044, some of the not connected pins of the tda8043 have become functional pins on the TDA8044. table 1 lists the modified pins of the TDA8044. table 1 modi?ed pins of the TDA8044 if it is required to replace the tda8043 with the TDA8044 and the pins with extra functionality are not required, then the following measures on the pcb layout must be taken to avoid i/o conflicts in the TDA8044: pin numbers 4, 5, 26, 27, 36, 37, 47, 65, 92, 93 and 95 must be put to ground pin numbers 39, 64 and 91 must be left not connected. with these measures it is possible to use the tda8043 and the TDA8044 on the same pcb without any problems. in order to use pins with the extra functionality of the TDA8044, pcb layout changes are necessary. pin tda8043 function TDA8044 symbol TDA8044 function 4 not connected cfs clock frequency selection 5 not connected v ssd2 digital ground 26 not connected p5 i/o expander bit 5 27 not connected p4 i/o expander bit 4 36 not connected v ssd6 digital ground 37 not connected v ssd7 digital ground 39 not connected por power-on reset 47 not connected v ssd9 digital ground 64 not connected sclt serial clock of i 2 c-bus loop-through 65 not connected sdat serial data of i 2 c-bus loop-through 91 not connected d22 22 khz generation output 92 not connected v ssd15 digital ground 93 not connected v ssd16 digital ground 95 not connected v ssd(test) test pin, connect to ground
2000 feb 21 10 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 limiting values in accordance with the absolute maximum rating system (iec 134). notes 1. maximum power dissipation is specified for 96 mhz clock frequency, 45 msymbols/s and a puncture rate of 7 8 . 2. maximum power dissipation is specified for 64 mhz clock frequency, 30 msymbols/s and a puncture rate of 7 8 . handling inputs and outputs are protected against electrostatic discharge in normal handling. however it is good practice to take normal precautions appropriate to handling mos devices (see handling mos devices ). thermal characteristics symbol parameter conditions min. max. unit v dd supply voltage pins - 0.3 +3.55 v v max maximum voltage on all pins 0 v dd v p tot total power dissipation TDA8044 t amb =70 c; note 1 - 1700 mw TDA8044a t amb =70 c; note 2 - 1250 mw t stg ic storage temperature - 55 +150 c t amb ambient temperature t amb =70 c070 c t j operating junction temperature 0 125 c symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air TDA8044 34 k/w TDA8044a 45 k/w
2000 feb 21 11 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 application information fig.2 satellite set-top decoder concept. handbook, full pagewidth mgm605 TDA8044 TDA8044a sdd saa7214 tmips saa7215 i q front panel control flash dram (optional) 1394 l + phy buffers ieee 1394 ieee 1284 rs232 audio dac rgb cvbs/yc l/r switching scart 1 scart 2 scart 3 16-mbit sdram 16-mbit sdram (optional) tda8060 tsa5056 tuner vxx modem tda8004 i 2 c-bus i 2 c-bus telecommunications operator if smart card(s) av_data rf input
2000 feb 21 12 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 handbook, full pagewidth 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 mgm607 TDA8044 TDA8044a cfs p3 p2 p1 p0 p5 p4 pdoclk pdo0 pdo1 22 khz v sd c (3) 330 nf 27 pf 27 pf c (3) v ddd2 100 nf v ddd1 c (3) v ddd c (3) v ddd2 c (3) v ddd2 c (3) c (3) v ddd2 v ddd1 n.c. v ddd1 v ddd1 c (3) v ddd1 c (3) v ddd1 v ddd2 100 nf 100 nf 10 nf v dda xtal (2) 100 nf 100 nf 10 w c (3) + 3.3 v + 5 v + 5 v 470 w 10 k w tuner agc (optional) + 3.3 v l (1) v dda 15 m f packet data and control outputs por pdo6 pdo7 pdoerr pdosync pdoval pdo5 pdo4 pdo3 pdo2 i 100 nf q tdi tdo tms interrupt i 2 c-bus input lock signals i 2 c-bus to tuner 4.7 k w 4.7 k w 470 k w 1.6 k w packet data and control outputs l (1) v ddd2 + 3.3 v 15 m f l (1) v ddd1 15 m f c (3) fig.3 application diagram. (1) b = smd bead type c8d8.9/3/3 grade 4s2. (2) f xtal = 4 mhz (fundamental). (3) c = 6.8 nf, smd.
2000 feb 21 13 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 package outline unit a 1 a 2 a 3 b p ce (1) eh e ll p z y w v q references outline version european projection issue date iec jedec eiaj mm 0.25 0.05 2.90 2.65 0.25 0.40 0.25 0.25 0.14 14.1 13.9 0.65 18.2 17.6 1.0 0.6 7 0 o o 0.15 0.1 0.2 1.95 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.0 0.6 sot317-2 mo-112 97-08-01 99-12-27 d (1) (1) (1) 20.1 19.9 h d 24.2 23.6 e z 0.8 0.4 d e q e a 1 a l p detail x l (a ) 3 b 30 c b p e h a 2 d z d a z e e v m a 1 100 81 80 51 50 31 pin 1 index x y b p d h v m b w m w m 0 5 10 mm scale qfp100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm sot317-2 a max. 3.20
2000 feb 21 14 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimum results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2000 feb 21 15 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, sqfp not suitable suitable hlqfp, hsqfp, hsop, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
2000 feb 21 16 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011.
2000 feb 21 17 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 notes
2000 feb 21 18 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 notes
2000 feb 21 19 philips semiconductors product speci?cation satellite demodulator and decoder TDA8044 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 69 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 753504/03/pp 20 date of release: 2000 feb 21 document order number: 9397 750 05972

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